TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's ...

TSMC, which acquired Innolux's 5.5G LCD fab in Tainan (southern Taiwan) in August, intends to acquire additional Innolux ...

Originally, the industry rumor mill expected TSMC's CoWoS capacity expansion to start leveling off by 2026. Early projections had the company's monthly packaging volume topping out around 100,000 ...

Additionally, TSMC has continued to explore new areas of growth, including advanced packaging technologies such as chip-on-wafer-on-substrate (CoWoS). These advanced packaging solutions are ...

NVIDIA's new Blackwell B200, AMD's Instinct MI300, and Intel's Gaudi 3 AI chips use CoWoS advanced packaging, which is 3.3x the size of the TSMC photomask, and can only cut about 16 wafers.

The companies will jointly define the specific packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip-on-Wafer-on-Substrate (CoWoS) that will be employed to address common customers ...

Additionally, TSMC has continued to explore new areas of growth, including advanced packaging technologies such as chip-on-wafer-on-substrate (CoWoS). These advanced packaging solutions are ...

For the next two years, Nvidia and AMD have secured TSMC's advanced packaging capacity for CoWoS and SoIC technologies, indicating that the giant companies are offering TSM a reliable market ...

Taken together, TSMC's upcoming entry into 2nm, combined with its proprietary advanced CoWoS packaging technology's mission-critical role in AI developments, underscores an impending upward re ...

Taiwan Semiconductor Manufacturing Co. on Wednesday beat forecasts in posting a sharp increase in its third-quarter revenues in a sign of ongoing demand for high tech chips driven by the ...

The lobby of the TSMC facility in Phoenix last year. “It’s just the beginning” for the “insane” demand for all things AI, C.C. Wei, the chief executive officer of Taiwan Semiconductor ...

TSMC halted shipments to the client around mid-October after it realized semiconductors fabricated for that entity had found their way into Huawei products, a person with direct knowledge of the ...