TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's ...

TSMC has been urging its factory engineering and equipment suppliers to expedite shipment pull-ins, enabling the contract chipmaker to raise its monthly output target for CoWoS packaging ...

The packaging technology is said to be strongly based on TSMC's chip-on-wafer-on-substrate with silicon interposer (CoWoS-S) and clearly distinguishable from Samsung's and Intel's packaging ...

Originally, the industry rumor mill expected TSMC's CoWoS capacity expansion to start leveling off by 2026. Early projections had the company's monthly packaging volume topping out around 100,000 ...

TSMC's leadership in advanced node processors (N2/A16) and advanced packaging technologies (CoWoS) positions it as a near-monopoly in leading-edge process technology. The global semiconductor ...

Additionally, TSMC has continued to explore new areas of growth, including advanced packaging technologies such as chip-on-wafer-on-substrate (CoWoS). These advanced packaging solutions are ...

NVIDIA's new Blackwell B200, AMD's Instinct MI300, and Intel's Gaudi 3 AI chips use CoWoS advanced packaging, which is 3.3x the size of the TSMC photomask, and can only cut about 16 wafers.

The companies will jointly define the specific packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip-on-Wafer-on-Substrate (CoWoS) that will be employed to address common customers ...

Additionally, TSMC has continued to explore new areas of growth, including advanced packaging technologies such as chip-on-wafer-on-substrate (CoWoS). These advanced packaging solutions are ...

Taken together, TSMC's upcoming entry into 2nm, combined with its proprietary advanced CoWoS packaging technology's mission-critical role in AI developments, underscores an impending upward re ...

Amkor began construction on its Arizona fab counting on TSMC to become its major customer, but the agreement to work with the patented CoWoS technology is still a happy surprise for many.

The lobby of the TSMC facility in Phoenix last year. “It’s just the beginning” for the “insane” demand for all things AI, C.C. Wei, the chief executive officer of Taiwan Semiconductor ...