Almost since the inception of MEMS, the idea of integrating MEMS devices with CMOS circuits has been a grand goal and a subject of much discussion in the industry. In fact, one of the driving forces ...
A new integrated poly-SiGe-based piezoresistive pressure sensor has been directly fabricated above 0.13 µm copper (Cu) -backend CMOS technology. This represents not only the first integrated poly-SiGe ...
Bullen offers MEMS glass wafers and polished glass substrates, both structured and blanks, in standard and non-standard sizes through 8” (200 mm). Our existing capability will support production of 12 ...
A surface micromachining technology for building microelectromechanical sensor and actuator systems in silicon stands out for its ability to fashion suspended structures that are anchored to the ...
(Nanowerk News) Imec realized an integrated poly-SiGe-based piezoresistive pressure sensor directly fabricated above 0.13 µm copper (Cu) -backend CMOS technology. This represents not only the first ...
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