Intel said it has figured out how to efficiently put two chips in a single package, which lowers costs and improves a computer’s overall performance. Mark Bohr, an Intel fellow, said at a press event ...

Intel's next-generation Lunar Lake CPUs are still in the ovens inside of their labs, but now we're hearing about the new Core Ultra 5 238V processor with 32GB of LPDDR5X on-package memory. If you ...

We're seeing Intel make those steps towards 1 trillion transistors by 2030, with the upcoming 14th Gen Core "Meteor Lake" CPUs set to feature a LEGO-like chiplet design, with advanced packaging ...

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Intel’s upcoming Nova Lake processors are going to feature some new changes in their platform design, with one of the biggest shifts being in the supporting chipset (PCH). The chipset will now use a ...

US President Joe Biden arrives for a ceremony at the groundbreaking of the Intel semiconductor manufacturing facility near New Albany, Ohio in 2022. He will be in Arizona late today. The U.S.

Intel Corp. researchers have developed a new technology that the company hopes will let chips reach speeds of 20GHz in the second half of this decade. The technological advance is not in the ...

Intel Corp. awarded Chief Executive Officer Pat Gelsinger compensation last year that could be worth nearly $180 million, tying much of it to whether his sweeping turnaround effort at the chip giant ...

The first fruit of the collaboration between Intel and its recent acquisition, Altera, is slated to arrive soon. Such products should afford server customers the flexibility to accelerate specific ...

SANTA CLARA, Calif. — Intel Corp. has developed a packaging technology that embeds a processor die into a specialized, pc-board-like package, getting rid of solder bumps and much of the interconnect ...