Customers can now access more capabilities and capacity for expanded production methods, simplifying custom mechanical sourcing. SAN FRANCISCO, Jan. 17, 2024 /PRNewswire/ -- Fictiv, a global ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

Chopped prepreg molding compound (CPMC), a relatively new material form resembling molding compounds made from chopped resin impregnated tow, provides design and processing engineers various benefits ...

Two of the biggest challenges in thermoplastic-composite molding are the high cost of metal tooling and the long lead times required to produce tools. Aside from the complexity of parts these ...